Scope of application
Instruments and meters, thick and extra thick glass industry cutting, such as ultra white glass, plain white glass, high borosilicate glass, quartz glass, etc;
Reinforced and non reinforced glass cutting, such as mobile phone glass cover, car glass cover, camera glass cover, etc;
Sapphire glass cutting, such as sapphire cover for mobile phones, sapphire glass cover for cameras, sapphire light strips (LED light strips), etc;
LCD screen glass cutting, such as: irregular LCD screen reverse R/U/C angle, LCD screen slitting, etc;
Other optical glass cutting, such as K9 glass, filter cutting, reflector cutting, etc.
Product introduction
The light source is a high-power picosecond laser;
Self developed glass cutting head, all lenses are imported, with fine light spot and long focal depth;
The X/Y-axis motor adopts high-end linear motor and German 0.1um digital grating ruler;
Support cutting and splitting into one, separate cutting, and separate splitting;
Standard PS0 function for motion control, evenly controlling the spacing between laser spot points;
The device is equipped with a CCD and a telecentric vision lens to accurately identify mark points such as circles and crosses. The electrical components are made by Schneider from France, and the switching power supply is made by Mingwei from Taiwan; One knife can cut a thickness within 19mm; The motor platform and optical platform base are made of natural marble, ensuring higher accuracy;
Equipment name | Dual platform picosecond laser glass cutting and splitting machine | Dual platform picosecond laser glass cutting machine | Single platform picosecond laser glass cutting machine |
Laser type | Infrared picosecond pulse laser | ||
Power | 50W (optional 10W, 20W, 30W, 60W, 80W, etc.) | ||
Wave length | 1064nm, optical mass: M2<1.2 | ||
Pulse width | water-cooling | ||
Cutting performance | |||
Drive motor | XY linear motor+grating ruler, positioning accuracy<± 2um, repeatability<± 1.5um, acceleration 1G, maximum linear velocity 1000mm/s | ||
Cutting speed | 0-500mm/s adjustable | ||
Cutting thickness | Ultra white glass with one cut ≤ 19mm, green plate glass with two cuts<19mm (choose the required laser power and cutting head focal depth according to product material, thickness, and speed requirements; material may affect processing thickness, thicker ones can be cut with multiple cuts) | ||
Minimum cutting edge breakage | ≤5um | ||
Cutting precision | <20um | ||
X/Y cutting stroke | 600x700mm. 600x900mm dual platform | 400x500mm,600x700mm,600x900mm dual platform | 400x500mm,600x700mm,600x900mm single platform |
Split laser source | |||
Laser type | Continuous laser | Optional single/dual platform independent splitting machine without splitting parts | Optional single/dual platform independent splitting machine without splitting parts |
Power | 150W (250W/350W optional) | ||
Wave length | 10.6um | ||
Pulse width | 1-100kHz | ||
Cooling method | water-cooling | ||
Power, size, and weight | |||
Voltage and power | <8KW.AC220V | <5KW,220V | <4KW,220V |
Equipment size | Length 2150mm x Width 2080mm x Height 1960mm | Length 1700mm x Width 1700mm x Height 1960mm | Length 1700mm x Width 1700mm x Height 1960mm |
Length 2550mm x Width 2080mm x Height 1960mm | Length 2150mm x Width 2080mm x Height 1960mm | Length 2150mm x Width 2080mm x Height 1960mm | |
Length 2550mm x Width 2080mm x Height 1960mm | Length 2550mm x Width 2080mm x Height 1960mm | ||
Weight | 3500KG/4000KG | 2000KG/3500KG/4000KG | 2000KG/2500KG/3000KG |
Ground bearing capacity | >700kg/m2 | >500-700kg/m2 | >500-700kg/m2 |